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 74LVT245 * 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs
November 1999 Revised November 2000
74LVT245 * 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs
General Description
The LVT245 and LVTH245 contain eight non-inverting bidirectional buffers with 3-STATE outputs and are intended for bus-oriented applications. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active-HIGH) enables data from A ports to B ports; Receive (active-LOW) enables data from B ports to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a HIGH Z condition. The LVTH245 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. These transceivers are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT245 and LVTH245 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation.
Features
s Input and output interface capability to systems at 5V VCC s Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH245), also available without bushold feature (74LVT245). s Live insertion/extraction permitted s Power Up/Down high impedance provides glitch-free bus loading s Outputs source/sink, -32 mA/+64 mA s Latch-up performance exceeds 500 mA s ESD performance: Human-body model > 2000V Machine model > 200V Charged-device model > 1000V
Ordering Code:
Order Number 74LVT245WM 74LVT245SJ 74LVT245MSA 74LVT245MTC 74LVTH245WM 74LVTH245SJ 74LVTH245MSA 74LVTH245MTC Package Number M20B M20D MSA20 MTC20 M20B M20D MSA20 MTC20 Package Description 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 20-Lead Small Outline Package (SOP), EIAJ TYPE II 5.3mm Wide 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter "X" to the ordering code.
Logic Symbols
IEEE/IEC
(c) 2000 Fairchild Semiconductor Corporation
DS500203
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74LVT245 * 74LVTH245
Connection Diagram
Pin Descriptions
Pin Names OE T/R A0-A7 B0-B7 Description Output Enable Input Transmit/Receive Input Side A Inputs or 3-STATE Outputs Side B Inputs or 3-STATE Outputs
Truth Table
Inputs Outputs OE L L H
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
T/R L H X Bus B Data to Bus A Bus A Data to Bus B HIGH-Z State
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2
74LVT245 * 74LVTH245
Absolute Maximum Ratings(Note 1)
Symbol VCC VI VO IIK IOK IO ICC IGND TSTG Parameter Supply Voltage DC Input Voltage Output Voltage DC Input Diode Current DC Output Diode Current DC Output Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Value Conditions Units V V Output in 3-STATE Output in HIGH or LOW State (Note 2) VI < GND VO < GND VO > VCC VO > VCC Output at HIGH State Output at LOW State V V mA mA mA mA mA
-0.5 to +4.6 -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -50 -50
64 128
64 128 -65 to +150
C
Recommended Operating Conditions
Symbol VCC VI IOH IOL TA Supply Voltage Input Voltage High-Level Output Current Low-Level Output Current Free Air Operating Temperature Input Edge Rate, VIN = 0.8V-2.0V, VCC = 3.0V Parameter Min 2.7 0 Max 3.6 5.5 Units V V mA mA
-32
64
-40
0
+85
10
C
ns/V
t/V
Note 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied. Note 2: IO Absolute Maximum Rating must be observed.
DC Electrical Characteristics
Symbol VIK VIH VIL VOH Parameter Input Clamp Diode Voltage Input HIGH Voltage Input LOW Voltage Output HIGH Voltage VCC (V) 2.7 2.7-3.6 2.7-3.6 2.7-3.6 2.7 3.0 VOL Output LOW Voltage 2.7 2.7 3.0 3.0 3.0 II(HOLD) (Note 3) II(OD) (Note 3) II Bushold Input Over-Drive Current to Change State Input Current Control Pins Data Pins IOFF IPU/PD IOZL IOZH Power Off Leakage Current Power Up/Down 3-STATE Current 3-STATE Output Leakage Current 3-STATE Output Leakage Current IOZL (Note 3) 3-STATE Output Leakage Current 3.6 3.6 3.6 0 0-1.5V 3.6 3.6 3.6 3.0 Bushold Input Minimum Drive 3.0 75 -75 500 -500 10 1 -5 1 100 100 -5 -5 5 VCC - 0.2 2.4 2.0 0.2 0.5 0.4 0.5 0.55 2.0 0.8 TA = -40C to +85C Min Max -1.2 Units V V V V V V V V V V A A A A A A A A A A A A A Conditions II = -18 mA VO 0.1V or VO VCC - 0.1V IOH = -100 A IOH = - 8 mA IOH = -32 mA IOL = 100 A IOL = 24 mA IOL = 16 mA IOL = 32 mA IOL = 64 mA VI = 0.8V VI = 2.0V (Note 4) (Note 5) VI = 5.5V VI = 0V or VCC VI = 0V VI = VCC 0V VI or VO 5.5V VO = 0.5V to VCC VI = GND to VCC VO = 0.5V VO = 0.0V VO = 3.0V
3
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74LVT245 * 74LVTH245
DC Electrical Characteristics
Symbol Parameter
(Continued)
VCC (V) 3.6 3.6 3.6 3.6 3.6 3.6 3.6 TA = -40C to +85C Min Max 5 10 0.19 5 0.19 0.19 0.2 A A mA mA mA mA mA VO = 3.6V VCC < VO 5.5V Outputs HIGH Outputs LOW Outputs Disabled VCC VO 5.5V, Outputs Disabled One Input at VCC - 0.6V Other Inputs at VCC or GND
Units
Conditions
IOZH (Note 3) 3-STATE Output Leakage Current IOZH+ ICCH ICCL ICCZ ICCZ+ ICC 3-STATE Output Leakage Current Power Supply Current Power Supply Current Power Supply Current Power Supply Current Increase in Power Supply Current (Note 6)
Note 3: Applies to Bushold versions only (LVTH245).
Note 4: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 5: An external driver must sink at least the specified current to switch from HIGH-to-LOW. Note 6: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
Dynamic Switching Characteristics
Symbol Parameter VCC (V) VOLP VOLV Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL 3.3 3.3
(Note 7)
TA = 25C Min Typ 0.8 -0.8 Max V V Units Conditions CL = 50 pF, RL = 500 (Note 8) (Note 8)
Note 7: Characterized in SOIC package. Guaranteed parameter, but not tested. Note 8: Max number of outputs defined as (n). n-1 data inputs are driven 0V to 3V. Output under test held LOW.
AC Electrical Characteristics
TA = -40C to +85C Symbol Parameter CL = 50 pF, RL = 500 VCC = 3.3V 0.3V Min tPLH tPHL tPZH tPZL tPHZ tPLZ tOSHL tOSLH Output to Output Skew (Note 9) Output Disable Output Enable Time Propagation Delay 1.2 1.2 1.3 1.7 2.0 2.0 Max 3.6 3.5 5.5 5.7 5.9 5.0 1.0 1.2 1.2 1.3 1.7 2.0 2.0 VCC = 2.7V Min Max 4.0 4.0 7.1 6.7 6.5 5.1 1.0 ns ns ns ns Units
Note 9: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).
Capacitance
Symbol CIN CI/O
(Note 10)
Parameter Conditions VCC = 0V, VI = 0V or VCC VCC = 3.0V, VO = 0V or VCC Typical 4 8 Units pF pF
Input Capacitance Input/Output Capacitance
Note 10: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
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4
74LVT245 * 74LVTH245
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II 5.3mm Wide Package Number M20D 5 www.fairchildsemi.com
74LVT245 * 74LVTH245
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20
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6
74LVT245 * 74LVTH245 Low Voltage Octal Bidirectional Transceiver with 3-STATE Inputs/Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 7 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com
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